LE75183BFQC Tech Specifications

Category Interface - Modems - ICs and Modules
Manufacturer Microsemi ZARLINK
Surface Mount YES
Number of Terminals 32Terminals
Risk Rank 5.55
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Supply Voltage-Nom 5 V
Package Description HVQCCN,
Part Package Code QFN
Ihs Manufacturer MICROSEMI CORP
Part Life Cycle Code Obsolete
Rohs Code Yes
Manufacturer Part Number LE75183BFQC
JESD-609 Code e3
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form NO LEAD
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Pin Count 32
JESD-30 Code S-XQCC-N32
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Seated Height-Max 1 mm
Telecom IC Type TELECOM CIRCUIT
Length 8 mm
Width 8 mm
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