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LE75183BFQC Tech Specifications
Category | Interface - Modems - ICs and Modules | |
Manufacturer | Microsemi ZARLINK | |
Surface Mount | YES | |
Number of Terminals | 32Terminals | |
Risk Rank | 5.55 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Supply Voltage-Nom | 5 V | |
Package Description | HVQCCN, | |
Part Package Code | QFN | |
Ihs Manufacturer | MICROSEMI CORP | |
Part Life Cycle Code | Obsolete | |
Rohs Code | Yes |
Manufacturer Part Number | LE75183BFQC | |
JESD-609 Code | e3 | |
Terminal Finish | MATTE TIN | |
HTS Code | 8542.39.00.01 | |
Terminal Position | QUAD | |
Terminal Form | NO LEAD | |
Number of Functions | 1Function | |
Terminal Pitch | 0.8 mm | |
Reach Compliance Code | compliant | |
Pin Count | 32 | |
JESD-30 Code | S-XQCC-N32 | |
Qualification Status | Not Qualified | |
Temperature Grade | INDUSTRIAL | |
Seated Height-Max | 1 mm | |
Telecom IC Type | TELECOM CIRCUIT | |
Length | 8 mm | |
Width | 8 mm |
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