| Image | Part # | Manufacturer | Description | Pricing | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Refresh Cycles | I2C Control Byte | Access Mode | Self Refresh | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. Part #X24325PIElecinsight Part #530-535-X24325PI | IC Microsystems Sdn Bhd |
EEPROM, 4KX8, Serial, CMOS, PDIP8, PLASTIC, DIP-8
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 8 | - | 0.1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 4096 words | 4000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | 240 | 1 | 2.54 mm | unknown | - | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | - | SYNCHRONOUS | 0.003 mA | 4KX8 | - | 4.32 mm | 8 | 0.00005 A | 32768 bit | - | SERIAL | - | EEPROM | I2C | 100000 Write/Erase Cycles | 10 ms | 100 | HARDWARE/SOFTWARE | - | - | - | DDDMMMMR | - | - | 10.03 mm | 7.62 mm | ||
| X24325PI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #NN514405BJ-60Elecinsight Part #530-535-NN514405BJ-60 | United Microelectronics Corporation |
EDO DRAM, 1MX4, 60ns, CMOS, PDSO20
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 20 | 60 ns | - | NIPPON STEEL SEMICONDUCTOR CORP | - | 1048576 words | 1000000 | 70 °C | - | PLASTIC/EPOXY | SOJ | SOJ, SOJ20/26,.34 | SOJ20/26,.34 | RECTANGULAR | SMALL OUTLINE | Obsolete | - | No | 5 V | e0 | - | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | J BEND | - | 1 | 1.27 mm | unknown | - | - | R-PDSO-J20 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.08 mA | 1MX4 | 3-STATE | - | 4 | 0.001 A | 4194304 bit | - | - | COMMON | EDO DRAM | - | - | - | - | - | - | - | 1024 | - | FAST PAGE WITH EDO | NO | - | - | ||
| NN514405BJ-60 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XL93LC56YElecinsight Part #530-535-XL93LC56Y | Exel Microelectronics Inc |
EEPROM, 128X16, Serial, CMOS, PDSO8,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 8 | - | 0.25 MHz | EXEL MICROELECTRONICS INC | - | 128 words | 128 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | - | - | RECTANGULAR | SMALL OUTLINE | Obsolete | - | - | 5 V | - | - | - | - | AUTOMATIC WRITE | - | DUAL | GULL WING | - | 1 | - | unknown | - | - | R-PDSO-G8 | Not Qualified | 5.5 V | INDUSTRIAL | 2.7 V | - | SYNCHRONOUS | - | 128X16 | 3-STATE | - | 16 | - | 2048 bit | - | SERIAL | - | EEPROM | MICROWIRE | - | 25 ms | - | - | - | - | - | - | - | - | - | - | ||
| XL93LC56Y | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #NN511000LJ-60Elecinsight Part #530-535-NN511000LJ-60 | United Microelectronics Corporation |
Fast Page DRAM, 1MX1, 60ns, CMOS, PDSO20
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 20 | 60 ns | - | NIPPON STEEL SEMICONDUCTOR CORP | - | 1048576 words | 1000000 | 70 °C | - | PLASTIC/EPOXY | SOJ | SOJ, SOJ20/26,.34 | SOJ20/26,.34 | RECTANGULAR | SMALL OUTLINE | Obsolete | - | No | 5 V | e0 | - | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | J BEND | - | 1 | 1.27 mm | unknown | - | - | R-PDSO-J20 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.055 mA | 1MX1 | 3-STATE | - | 1 | 0.00005 A | 1048576 bit | - | - | SEPARATE | FAST PAGE DRAM | - | - | - | - | - | - | - | 512 | - | FAST PAGE | - | - | - | ||
| NN511000LJ-60 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #X24164P-2.7Elecinsight Part #530-535-X24164P-2.7 | IC Microsystems Sdn Bhd |
EEPROM, 2KX8, Serial, CMOS, PDIP8, PLASTIC, DIP-8
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 8 | - | 0.1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 2048 words | 2000 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | - | - | EAR99 | - | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | 240 | 1 | 2.54 mm | unknown | - | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | COMMERCIAL | 2.7 V | - | SYNCHRONOUS | 0.003 mA | 2KX8 | - | 4.32 mm | 8 | 0.00005 A | 16384 bit | - | SERIAL | - | EEPROM | I2C | 100000 Write/Erase Cycles | 10 ms | 100 | - | - | - | - | 1DDDMMMR | - | - | 10.03 mm | 7.62 mm | ||
| X24164P-2.7 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #X25642SI-2.7Elecinsight Part #530-535-X25642SI-2.7 | IC Microsystems Sdn Bhd |
Description: EEPROM, 8KX8, Serial, CMOS, PDSO14, PLASTIC, SOIC-14
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 14 | - | 2 MHz | IC MICROSYSTEMS SDN BHD | 3 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP14,.25 | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | unknown | - | 14 | R-PDSO-G14 | Not Qualified | 5.5 V | INDUSTRIAL | 2.7 V | - | SYNCHRONOUS | 0.005 mA | 8KX8 | - | 1.75 mm | 8 | 0.000001 A | 65536 bit | - | SERIAL | - | EEPROM | SPI | 100000 Write/Erase Cycles | 10 ms | 100 | HARDWARE/SOFTWARE | - | - | - | - | - | - | 8.65 mm | 3.9 mm | ||
| X25642SI-2.7 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #X25256S8Elecinsight Part #530-535-X25256S8 | IC Microsystems Sdn Bhd |
EEPROM
Datasheet
Compare
| Min.:1 Mult.:1 | - | - | - | - | IC MICROSYSTEMS SDN BHD | 3 | - | - | - | - | - | - | , | - | - | - | Obsolete | - | No | - | - | - | EAR99 | - | - | 8542.32.00.51 | - | - | 240 | - | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| X25256S8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #EDI88128LPS55CBElecinsight Part #530-535-EDI88128LPS55CB | Microsemi Corporation |
Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 32 | 55 ns | - | MICROSEMI CORP | - | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | DIP32,.6 | RECTANGULAR | IN-LINE | Transferred | DIP | No | 5 V | - | No | 3A001.A.2.C | - | - | 8542.32.00.41 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | unknown | NOT SPECIFIED | 32 | R-CDIP-T32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | ASYNCHRONOUS | 0.2 mA | 128KX8 | 3-STATE | - | 8 | 0.002 A | 1048576 bit | MIL-STD-883 | PARALLEL | COMMON | STANDARD SRAM | - | - | - | - | - | 2 V | - | - | - | - | - | - | 10.16 mm | ||
| EDI88128LPS55CB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XLS93LC66P-3Elecinsight Part #530-535-XLS93LC66P-3 | Exel Microelectronics Inc |
EEPROM, 256X16, Serial, CMOS, PDIP8,
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 8 | - | - | EXEL MICROELECTRONICS INC | - | 256 words | 256 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | - | No | - | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | - | - | 2.54 mm | unknown | - | - | R-PDIP-T8 | Not Qualified | - | COMMERCIAL | - | - | - | 0.002 mA | 256X16 | - | - | 16 | 0.000002 A | 4096 bit | - | SERIAL | - | EEPROM | MICROWIRE | 100000 Write/Erase Cycles | - | 10 | SOFTWARE | - | - | - | - | - | - | - | - | ||
| XLS93LC66P-3 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #NN514265AJ-50Elecinsight Part #530-535-NN514265AJ-50 | United Microelectronics Corporation |
EDO DRAM, 256KX16, 50ns, CMOS, PDSO40
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 40 | 50 ns | - | NIPPON STEEL SEMICONDUCTOR CORP | - | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | SOJ | SOJ, SOJ40,.44 | SOJ40,.44 | RECTANGULAR | SMALL OUTLINE | Obsolete | - | No | 5 V | e0 | - | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | J BEND | - | 1 | 1.27 mm | unknown | - | - | R-PDSO-J40 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.12 mA | 256KX16 | 3-STATE | - | 16 | 0.001 A | 4194304 bit | - | - | COMMON | EDO DRAM | - | - | - | - | - | - | - | 512 | - | FAST PAGE WITH EDO | NO | - | - | ||
| NN514265AJ-50 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #X24026YElecinsight Part #530-535-X24026Y | IC Microsystems Sdn Bhd |
Description: EEPROM, 256X8, Serial, CMOS, SMART CARD-8
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 8 | - | 0.1 MHz | IC MICROSYSTEMS SDN BHD | - | 256 words | 256 | 70 °C | - | UNSPECIFIED | - | , | - | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | CARD | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | UNSPECIFIED | UNSPECIFIED | - | 1 | - | unknown | - | 8 | R-XXMA-X8 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | - | SYNCHRONOUS | - | 256X8 | - | - | 8 | - | 2048 bit | - | SERIAL | - | EEPROM | I2C | - | 10 ms | - | - | - | - | - | - | - | - | - | - | ||
| X24026Y | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #UM6264AM-10LElecinsight Part #530-535-UM6264AM-10L | United Microelectronics Corporation |
Standard SRAM, 8KX8, 100ns, CMOS, PDSO28
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 28 | 100 ns | - | UNITED MICROELECTRONICS CORP | - | 8192 words | 8000 | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, SOP28,.5 | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | Obsolete | - | No | 5 V | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.41 | DUAL | GULL WING | - | - | 1.27 mm | unknown | - | - | R-PDSO-G28 | Not Qualified | - | COMMERCIAL | - | - | ASYNCHRONOUS | 0.045 mA | 8KX8 | 3-STATE | - | 8 | 0.0001 A | 65536 bit | - | PARALLEL | COMMON | STANDARD SRAM | - | - | - | - | - | 2 V | - | - | - | - | - | - | - | ||
| UM6264AM-10L | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #WS128K32V-20G2UIElecinsight Part #530-535-WS128K32V-20G2UI | Microsemi Corporation |
SRAM Module, 128KX32, 20ns, CMOS, CQFP68, 22.40 X 22.40 MM, CERAMIC, QFP-68
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 68 | 20 ns | - | MICROSEMI CORP | - | 131072 words | 128000 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | QFP | 22.40 X 22.40 MM, CERAMIC, QFP-68 | - | SQUARE | FLATPACK | Transferred | QFP | No | 3.3 V | e4 | No | 3A991.B.2.A | GOLD | ALSO CONFIGURABLE AS 512K X 8 | 8542.32.00.41 | QUAD | GULL WING | - | 1 | 1.27 mm | unknown | - | 68 | S-CQFP-G68 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | - | ASYNCHRONOUS | - | 128KX32 | - | 3.51 mm | 32 | - | 4194304 bit | - | PARALLEL | - | SRAM MODULE | - | - | - | - | - | - | 16 | - | - | - | - | 22.36 mm | 22.36 mm | ||
| WS128K32V-20G2UI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #X25080VElecinsight Part #530-535-X25080V | IC Microsystems Sdn Bhd |
Description: EEPROM, 1KX8, Serial, CMOS, PDSO14, PLASTIC, TSSOP-14
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 14 | - | 2 MHz | IC MICROSYSTEMS SDN BHD | 3 | 1024 words | 1000 | 70 °C | - | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP14,.25 | TSSOP14,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 0.65 mm | unknown | - | 14 | R-PDSO-G14 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | - | SYNCHRONOUS | 0.005 mA | 1KX8 | - | 1.2 mm | 8 | 0.000001 A | 8192 bit | - | SERIAL | - | EEPROM | SPI | 100000 Write/Erase Cycles | 10 ms | 100 | HARDWARE/SOFTWARE | - | - | - | - | - | - | 5 mm | 4.4 mm | ||
| X25080V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #NN514405J-60Elecinsight Part #530-535-NN514405J-60 | United Microelectronics Corporation |
EDO DRAM, 1MX4, 60ns, CMOS, PDSO20
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 20 | 60 ns | - | NIPPON STEEL SEMICONDUCTOR CORP | - | 1048576 words | 1000000 | 70 °C | - | PLASTIC/EPOXY | SOJ | SOJ, SOJ20/26,.34 | SOJ20/26,.34 | RECTANGULAR | SMALL OUTLINE | Obsolete | - | No | 5 V | e0 | - | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | J BEND | - | 1 | 1.27 mm | unknown | - | - | R-PDSO-J20 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.11 mA | 1MX4 | 3-STATE | - | 4 | 0.001 A | 4194304 bit | - | - | COMMON | EDO DRAM | - | - | - | - | - | - | - | 1024 | - | FAST PAGE WITH EDO | NO | - | - | ||
| NN514405J-60 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #WS512K32-25G2UMElecinsight Part #530-535-WS512K32-25G2UM | Microsemi Corporation |
SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 68 | 25 ns | - | MICROSEMI CORP | - | 524288 words | 512000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QFP | 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | - | SQUARE | FLATPACK | Transferred | QFP | No | 5 V | e4 | No | 3A001.A.2.C | GOLD | USER CONFIGURABLE AS 2M X 8 | 8542.32.00.41 | QUAD | GULL WING | - | 1 | 1.27 mm | unknown | - | 68 | S-CQFP-G68 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | ASYNCHRONOUS | - | 512KX32 | - | 3.51 mm | 32 | - | 16777216 bit | MIL-STD-883 | PARALLEL | - | SRAM MODULE | - | - | - | - | - | - | 16 | - | - | - | - | 22.36 mm | 22.36 mm | ||
| WS512K32-25G2UM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #X24C02MI-3.5Elecinsight Part #530-535-X24C02MI-3.5 | IC Microsystems Sdn Bhd |
Description: EEPROM, 256X8, Serial, CMOS, PDSO8, MSOP-8
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 8 | - | 0.1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.19 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | MSOP | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 0.65 mm | unknown | - | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | INDUSTRIAL | 3.5 V | - | SYNCHRONOUS | 0.002 mA | 256X8 | - | 1.07 mm | 8 | 0.00005 A | 2048 bit | - | SERIAL | - | EEPROM | I2C | 100000 Write/Erase Cycles | 10 ms | 100 | HARDWARE | - | - | - | 1010DDDR | - | - | 3 mm | 3 mm | ||
| X24C02MI-3.5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #EDI88128LPS35FBElecinsight Part #530-535-EDI88128LPS35FB | Microsemi Corporation |
Standard SRAM, 128KX8, 35ns, CMOS, CDFP32, CERAMIC, FP-32
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 32 | 35 ns | - | MICROSEMI CORP | - | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DFP | CERAMIC, DFP-32 | FL32,.4 | RECTANGULAR | FLATPACK | Transferred | DFP | No | 5 V | - | No | 3A001.A.2.C | - | - | 8542.32.00.41 | DUAL | FLAT | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | 32 | R-CDFP-F32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | ASYNCHRONOUS | 0.2 mA | 128KX8 | 3-STATE | 2.9464 mm | 8 | 0.002 A | 1048576 bit | MIL-STD-883 | PARALLEL | COMMON | STANDARD SRAM | - | - | - | - | - | 2 V | - | - | - | - | - | 20.828 mm | 10.414 mm | ||
| EDI88128LPS35FB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #X24C08P-3.5Elecinsight Part #530-535-X24C08P-3.5 | IC Microsystems Sdn Bhd |
EEPROM, 1KX8, Serial, CMOS, PDIP8, PLASTIC, DIP-8
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 8 | - | 0.1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 1024 words | 1000 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | 240 | 1 | 2.54 mm | unknown | - | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | COMMERCIAL | 3.5 V | - | SYNCHRONOUS | 0.003 mA | 1KX8 | - | 4.07 mm | 8 | 0.00015 A | 8192 bit | - | SERIAL | - | EEPROM | I2C | 100000 Write/Erase Cycles | 10 ms | 100 | - | - | - | - | 1010DMMR | - | - | 10.03 mm | 7.62 mm | ||
| X24C08P-3.5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #WMS128K8-55CCElecinsight Part #530-535-WMS128K8-55CC | Microsemi Corporation |
Description: Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 32 | 55 ns | - | MICROSEMI CORP | - | 131072 words | 128000 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, | - | RECTANGULAR | IN-LINE | Transferred | DIP | No | 5 V | e4 | No | EAR99 | GOLD | - | 8542.32.00.41 | DUAL | THROUGH-HOLE | - | 1 | - | compliant | - | 32 | R-CDIP-T32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | - | ASYNCHRONOUS | - | 128KX8 | - | 5.13 mm | 8 | - | 1048576 bit | - | PARALLEL | - | STANDARD SRAM | - | - | - | - | - | - | - | - | - | - | - | 42.2 mm | - | ||
| WMS128K8-55CC |
Index :
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