Image | Part # | Manufacturer | Description | Pricing | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | Memory IC Type | Endurance | Data Retention Time-Min | Total Dose | Length | Width |
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Mfr. Part #5962-9951401QXXElecinsight Part #903-535-5962-9951401QXX | AMD Xilinx |
Configuration Memory
Datasheet
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| Min.:1 Mult.:1 | - | - | - | - | XILINX INC | - | - | - | - | - | - | - | , | - | - | - | Obsolete | - | - | - | - | - | 3A001.A.2.C | - | - | - | 8542.32.00.51 | - | - | - | - | - | unknown | - | - | - | Not Qualified | - | - | - | - | - | - | - | - | - | - | - | - | CONFIGURATION MEMORY | - | - | - | - | - | |||
5962-9951401QXX | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. Part #XC17S200XLSOG20CElecinsight Part #903-535-XC17S200XLSOG20C | AMD Xilinx |
Description: Configuration Memory, 1335872X1, Serial, CMOS, PDSO20, PLASTIC, SOIC-20
Datasheet
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| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 1335872 words | 1335872 | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 3.3 V | e3 | Yes | 3A991.B.1.B.1 | - | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | - | 1335872X1 | - | 2.65 mm | 1 | - | 1335872 bit | SERIAL | CONFIGURATION MEMORY | - | - | - | 12.8 mm | 7.5 mm | |||
XC17S200XLSOG20C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. Part #XC18256SO20CElecinsight Part #903-535-XC18256SO20C
IN STOCK: 156
| AMD Xilinx |
Configuration Memory, 256KX1, 45ns, Parallel, CMOS, PDSO20, SOP-20
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 20 | 45 ns | 15 MHz | XILINX INC | 3 | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | SOP | SOP-20 | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.3 V | e0 | - | EAR99 | NOR TYPE | TIN LEAD | SERIAL MODE ALSO AVAILABLE | 8542.32.00.51 | DUAL | GULL WING | 225 | 1 | 1.27 mm | not_compliant | 30 | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | 0.03 mA | 256KX1 | - | 2.65 mm | 1 | 0.0001 A | 262144 bit | PARALLEL | CONFIGURATION MEMORY | 10000 Write/Erase Cycles | 10 | - | 12.8 mm | 7.5 mm | |||
XC18256SO20C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. Part #XQR18V04CCG44VElecinsight Part #903-535-XQR18V04CCG44V
IN STOCK: 803
| AMD Xilinx |
Configuration Memory, 512X8, Parallel/serial, CMOS, CQCC44, CERAMIC, LCC-44
Datasheet
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| Min.:1 Mult.:1 | YES | 44 | - | - | XILINX INC | - | 512 words | 512 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LCC | - | 3.3 V | e3 | - | 3A001.A.2.C | - | MATTE TIN | - | 8542.32.00.51 | QUAD | J BEND | - | 1 | 1.27 mm | unknown | - | 44 | S-CQCC-J44 | Not Qualified | 3.6 V | MILITARY | 3 V | SYNCHRONOUS | - | 512X8 | - | 4.826 mm | 8 | - | 4096 bit | PARALLEL/SERIAL | CONFIGURATION MEMORY | - | - | 40k Rad(Si) V | 16.51 mm | 16.51 mm | |||
XQR18V04CCG44V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. Part #XC17V08VQG44CElecinsight Part #903-535-XC17V08VQG44C | AMD Xilinx |
Description: Configuration Memory, 1MX8, Parallel/serial, CMOS, PQFP44, PLASTIC, QFP-44
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 44 | - | - | XILINX INC | 3 | 1048576 words | 1000000 | 70 °C | - | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | Yes | 3.3 V | e3 | Yes | 3A991.B.1.B.1 | - | Matte Tin (Sn) | - | 8542.32.00.51 | QUAD | GULL WING | 260 | 1 | 0.8 mm | compliant | 30 | 44 | S-PQFP-G44 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | - | 1MX8 | - | 1.2 mm | 8 | - | 8388608 bit | PARALLEL/SERIAL | CONFIGURATION MEMORY | - | - | - | 10 mm | 10 mm | |||
XC17V08VQG44C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. Part #XC18V128VQ44IElecinsight Part #903-535-XC18V128VQ44I
IN STOCK: 160
| AMD Xilinx |
Configuration Memory, 128KX1, 20ns, Parallel/serial, CMOS, PQFP44, PLASTIC, VQFP-44
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 44 | 20 ns | - | XILINX INC | 3 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | No | 3.3 V | e0 | - | EAR99 | - | TIN LEAD | - | 8542.32.00.51 | QUAD | GULL WING | - | 1 | 0.8 mm | compliant | - | 44 | S-PQFP-G44 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 128KX1 | - | 1.2 mm | 1 | - | 131072 bit | PARALLEL/SERIAL | CONFIGURATION MEMORY | - | - | - | 10 mm | 10 mm | |||
XC18V128VQ44I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. Part #XC17S15AVOG8IElecinsight Part #903-535-XC17S15AVOG8I
IN STOCK: 663
| AMD Xilinx |
Configuration Memory, 197696X1, Serial, CMOS, PDSO8, PLASTIC, TSOP-8
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 8 | - | - | XILINX INC | 3 | 197696 words | 197696 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, | - | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | Yes | 3.3 V | e3 | Yes | EAR99 | - | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 197696X1 | - | 1.2 mm | 1 | - | 197696 bit | SERIAL | CONFIGURATION MEMORY | - | - | - | 4.9 mm | 3.9 mm | |||
XC17S15AVOG8I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. Part #XQ1704LPC44NElecinsight Part #903-535-XQ1704LPC44N
IN STOCK: 573
| AMD Xilinx |
Configuration Memory, 4MX1, Serial, CMOS, PQCC44, CC-44
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 44 | - | - | XILINX INC | 3 | 4194304 words | 4000000 | 125 °C | -55 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | QFN | No | 3.3 V | e0 | - | 3A001.A.2.C | - | TIN LEAD | - | 8542.32.00.51 | QUAD | J BEND | - | 1 | 1.27 mm | compliant | - | 44 | S-PQCC-J44 | Not Qualified | 3.6 V | MILITARY | 3 V | SYNCHRONOUS | - | 4MX1 | - | 4.57 mm | 1 | - | 4194304 bit | SERIAL | CONFIGURATION MEMORY | - | - | - | 16.5862 mm | 16.5862 mm | |||
XQ1704LPC44N | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. Part #XC17256D-DDG8MElecinsight Part #903-535-XC17256D-DDG8M
IN STOCK: 914
| AMD Xilinx |
Configuration Memory, 256KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 8 | - | - | XILINX INC | - | 262144 words | 256000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | DIP | Yes | 5 V | e3 | Yes | 3A001.A.2.C | - | MATTE TIN | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | compliant | - | 8 | R-GDIP-T8 | Not Qualified | 5.5 V | MILITARY | 4.5 V | SYNCHRONOUS | - | 256KX1 | 3-STATE | 4.318 mm | 1 | - | 262144 bit | SERIAL | CONFIGURATION MEMORY | - | - | - | 9.906 mm | 7.62 mm | |||
XC17256D-DDG8M | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. Part #XC17256EVOG8CElecinsight Part #903-535-XC17256EVOG8C
IN STOCK: 608
| AMD Xilinx |
Configuration Memory, 256KX1, Serial, CMOS, PDSO8, PLASTIC, TSOP-8
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 8 | - | - | XILINX INC | 3 | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | TSOP2 | TSOP2, | - | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | Yes | 5 V | e3 | - | EAR99 | - | MATTE TIN | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | SYNCHRONOUS | - | 256KX1 | - | 1.1938 mm | 1 | - | 262144 bit | SERIAL | CONFIGURATION MEMORY | - | - | - | 4.9276 mm | 3.937 mm | |||
XC17256EVOG8C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. Part #XC1701-PD8MElecinsight Part #903-535-XC1701-PD8M | AMD Xilinx |
Description: Configuration Memory, 1MX1, 45ns, Parallel, CMOS, PDIP8, PLASTIC, DIP-8
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 8 | 45 ns | - | XILINX INC | 1 | 1048576 words | 1000000 | 125 °C | -55 °C | PLASTIC/EPOXY | DIP | DIP, | - | RECTANGULAR | IN-LINE | Transferred | DIP | No | 5 V | e0 | No | 3A001.A.2.C | - | TIN LEAD | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | compliant | - | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | MILITARY | 4.5 V | SYNCHRONOUS | - | 1MX1 | - | 4.5974 mm | 1 | - | 1048576 bit | PARALLEL | CONFIGURATION MEMORY | - | - | - | 9.3599 mm | 7.62 mm | |||
XC1701-PD8M |
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