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N82S131F Tech Specifications

Category Memory - Modules
Manufacturer NXP
Surface Mount NO
Weight 0.25 kg
Number of Terminals 16Terminals
Gross weight 263.50
Transport packaging size/quantity 28*25*35/100
Equivalent POS-60
Melting temperature 183...190 °C
Soldering temperature 250...265 °C
Flux -
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Access Time-Max 50 ns
Number of Words 512 wordsWord
Number of Words Code 512Words Codes
Operating Temperature-Max 75 °C
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 5 V
Packaging reel
JESD-609 Code e0
ECCN Code EAR99
Type Soft tin-lead solder Sn/Pb
Terminal Finish TIN LEAD
Composition tin - 60%; lead - 40%
HTS Code 8542.32.00.71
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-GDIP-T16
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.25 V
Temperature Grade COMMERCIAL EXTENDED
Supply Voltage-Min (Vsup) 4.75 V
Operating Mode ASYNCHRONOUS
Organization 512X4
Output Characteristics 3-STATE
Memory Width 4
Memory Density 2048 bit
Form wire
Parallel/Serial PARALLEL
Memory IC Type OTP ROM
Diameter 0.5 mm
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