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- CXD5602PWBLM1NA
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CXD5602PWBLM1NA Tech Specifications
| Category | RF Evaluation and Development Kits, Boards | |
| Manufacturer | ||
| Contact Plating | Lead, Tin | |
| Mount | Through Hole | |
| RoHS | Compliant | |
| Description/Function | LTE Extension Boards | |
| Interface Type | I2C, UART | |
| Manufacturer | Sony | |
| Brand | Sony Spresense | |
| Tolerance | 1 % | |
| Temperature Coefficient | 50 ppm/°C | |
| Resistance | 3.48 kΩ |
| Max Operating Temperature | 175 °C | |
| Min Operating Temperature | -65 °C | |
| Composition | Metal Film | |
| Subcategory | Development Tools | |
| Military Standard | MIL-PRF-55182 | |
| Operating Supply Voltage | 5 V | |
| Product Type | Cellular Development Tools | |
| Product | Expansion Boards | |
| Product Category | Cellular Development Tools | |
| Length | 17.45 mm | |
| Diameter | 4.57 mm |
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