Hai Hon Technology, which trades as Foxconn, is to buy a 150mm (6in) wafer fab in Hsincu, Taiwan, from memory maker Macronix.
Hai Hon Technology, which trades as Foxconn, is to buy a 150mm (6in) wafer fab in Hsincu, Taiwan, from memory maker Macronix. The fab will be repurposed for SiC power devices after the deal closes by the end of 2021.
“The acquisition of the 6-inch wafer fab in Hsinchu Science Park officially signals Foxconn’s entry into the manufacture and development of wide band gap semiconductors, especially SiC, paving the way for a long-term commitment to semiconductor development,” said Young Liu, Chairman and CEO of Foxconn.
This will be key for the company’s ambitions to make electric vehicles for customers in the same way it makes PCs and Apple iPhones. The deal follows Texas Instruments buying Micron’s memmory fab in Utah, also for $900m, to boost its power and analogue device capacity. The deal will also put Foxconn in direct competition with STMicroelectronics in both sale of SiC devices and for SiC wafers.
“The manufacturing of SiC is in line with Foxconn’s 3 3 strategy (EV, digital health, Robotics AI, semiconductor, advanced communication). SiC MOSFET is an important device for EV, while EV occupies the No.1 position in Foxconn’s 3 3 strategy,” said Liu at Foxconn. “The 6-inch wafer fab will function as S Business Group’s headquarters in Hsinchu, the famous semiconductor cluster, enabling closer partnership with the semiconductor companies based in the Hsinchu Science Park.” This includes TSMC which is a major supplier to Foxconn.
The deal will see Macronix focus on its 300mm (12in) wafer capacity for memory devices.
“To enhance advanced technology and global competitiveness, Macronix will focus on 12-inch wafer business, especially R&D and manufacturing of the advanced 3D NAND Flash and NOR Flash products after capacity expansion,” said Miin Wu, Chairman and CEO of Macronix.
