220-3342-00-0602J Tech Specifications

Category Sockets for ICs, Transistors
Manufacturer 3M
Factory Lead Time 8 Weeks
Contact Plating Gold
Mount Through Hole
Mounting Type Connector
Package / Case DIP
Number of Pins 20Pins
Housing Material Polysulfone (PSU), Glass Filled
Body Material Glass, Polysulfone
Number of Positions or Pins (Grid) 20 (2 x 10)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Contact Finish Mating Gold
Contact Materials Copper
Insulation Materials Polysulfone
Operating Temperature -55°C~125°C
Packaging Bulk
Series Textool™
Published 2000
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Press-Fit
Connector Type DIP, Socket
Type DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing
Number of Positions 20Positions
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Number of Rows 2Rows
Gender Female
Current Rating (Amps) 1A
Pitch 2.54mm
Orientation Straight
Depth 15.2mm
Current Rating 1A
Pitch - Mating 0.100 2.54mm
Lead Pitch 2.54mm
Number of Contacts 20Contacts
Contact Finish - Post Gold
Insulation Resistance 1GOhm
Row Spacing 7.62 mm
Number of Poles 20Poles
Termination Post Length 0.110 2.78mm
Pitch - Post 0.100 2.54mm
Features Closed Frame
Length 52.7mm
Width 11.9mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 30.0μin 0.76μm
Material Flammability Rating UL94 V-0
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
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