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- 228-7474-55-1902
IN STOCK
: 34
Min. : 1
Mult. : 1

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228-7474-55-1902 Tech Specifications
| Category | Sockets for ICs, Transistors | |
| Manufacturer | 3M | |
| Factory Lead Time | 8 Weeks | |
| Contact Plating | Gold | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Package / Case | SOIC | |
| Number of Pins | 28Pins | |
| Housing Material | Polyethersulfone (PES), Glass Filled | |
| Weight | 453.59237g | |
| Number of Positions or Pins (Grid) | 28 (2 x 14) | |
| Contact Material - Mating | Beryllium Copper | |
| Contact Material - Post | Beryllium Copper | |
| Contact Finish Mating | Gold | |
| Contact Materials | Copper | |
| Operating Temperature | -55°C~150°C | |
| Packaging | Bulk | |
| Series | Textool™ | |
| Published | 2001 |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Type | SOIC | |
| Number of Positions | 28Positions | |
| Number of Rows | 2Rows | |
| Gender | Female | |
| Current Rating (Amps) | 1A | |
| Pitch | 1.27mm | |
| Orientation | Straight | |
| Current Rating | 1A | |
| Number of Contacts | 28Contacts | |
| Contact Finish - Post | Gold | |
| Termination Post Length | 0.140 3.56mm | |
| Features | Closed Frame | |
| Contact Finish Thickness - Post | 30.0μin 0.76μm | |
| Material Flammability Rating | UL94 V-0 | |
| RoHS Status | RoHS Compliant | |
| Lead Free | Lead Free |
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228-7474-55-1902 Documents
Download datasheets and manufacturer documentation for 228-7474-55-1902
- DatasheetsTest & Burn-In SOIC Sockets Datasheet SOIC Socket Pin Sequence
- ConflictMineralStatement3M-company-24.pdf
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