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239-5605-02-0602 Tech Specifications

Category Sockets for ICs, Transistors
Manufacturer 3M
Factory Lead Time 8 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case 0602
Number of Pins 39Pins
Housing Material Polysulfone (PSU), Glass Filled
Number of Positions or Pins (Grid) 39 (1 x 19, 1 x 20)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Contact Finish Mating Gold
Operating Temperature -55°C~150°C
Packaging Bulk
Published 2001
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type Zig-Zag
Gender Female
Current Rating (Amps) 1A
Pitch - Mating 0.100 2.54mm
Contact Resistance 25mOhm
Termination Post Length 0.100 2.54mm
Pitch - Post 0.100 2.54mm
Features Closed Frame
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 30.0μin 0.76μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
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