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AM27S29/BRA Tech Specifications

Category Memory
Manufacturer AMD
Package / Case 20-CDIP (0.300", 7.62mm)
Mounting Type Through Hole
Surface Mount NO
Supplier Device Package 20-CDIP
Number of Terminals 20Terminals
Mfr Advanced Micro Devices
Memory Types Non-Volatile
Product Status Active
Package Bulk
Base Product Number AM27S29
Package Description CERAMIC, DIP-20
Package Style IN-LINE
Number of Words Code 512Words Codes
Package Body Material CERAMIC, GLASS-SEALED
Operating Temperature-Min -55 °C
Access Time-Max 70 ns
Operating Temperature-Max 125 °C
Manufacturer Part Number AM27S29/BRA
Number of Words 512 wordsWord
Supply Voltage-Nom (Vsup) 5 V
Package Code DIP
Package Shape RECTANGULAR
Manufacturer Rochester Electronics LLC
Part Life Cycle Code Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC
Risk Rank 5.26
Part Package Code DIP
Series -
Operating Temperature -55°C ~ 125°C (TC)
ECCN Code EAR99
HTS Code 8542.32.00.71
Voltage - Supply 4.5V ~ 5.5V
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
Pin Count 20
JESD-30 Code R-GDIP-T20
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Temperature Grade MILITARY
Supply Voltage-Min (Vsup) 4.5 V
Memory Size 4Kbit
Operating Mode ASYNCHRONOUS
Access Time 70 ns
Memory Format PROM
Memory Interface Parallel
Organization 512X8
Seated Height-Max 5.08 mm
Memory Width 8
Write Cycle Time - Word, Page -
Memory Density 4096 bit
Parallel/Serial PARALLEL
Memory IC Type OTP ROM
Memory Organization 512 x 8
Width 7.62 mm
Length 24.257 mm
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