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EP2AGX65DF25C4N Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer ALTERA
Mounting Type Surface Mount
Package / Case 572-BGA, FCBGA
Surface Mount YES
Supplier Device Package 572-FBGA, FC (25x25)
Number of Terminals 572Terminals
Number of I/Os 252I/Os
Package Equivalence Code BGA572,24X24,40
Supply Voltage-Nom 0.9 V
Reflow Temperature-Max (s) 40
Supply Voltage-Min 0.87 V
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number EP2AGX65DF25C4N
Clock Frequency-Max 500 MHz
Package Code HBGA
Package Description 25 X 25 MM, LEAD FREE, MS-034, FBGA-572
Package Style GRID ARRAY, HEAT SINK/SLUG
Moisture Sensitivity Levels 3
Package Body Material PLASTIC/EPOXY
Package Shape SQUARE
Manufacturer Intel Corporation
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Supply Voltage-Max 0.93 V
Risk Rank 5.25
Operating Temperature 0°C ~ 85°C (TJ)
Series Arria II GX
JESD-609 Code e1
Part Status Active
ECCN Code 3A991
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 0.87 V ~ 0.93 V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 1 mm
Reach Compliance Code compliant
Base Part Number EP2AGX65
JESD-30 Code S-PBGA-B572
Number of Outputs 252Outputs
Qualification Status Not Qualified
Power Supplies 0.9,1.2/3.3,1.5,2.5 V
Temperature Grade OTHER
Number of Inputs 252Inputs
Seated Height-Max 2.2 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 60214Logic Elements/Cells
Total RAM Bits 5371904
Number of LABs/CLBs 2530LABs/CLBs
Number of Logic Cells 60214Logic Cells
Width 25 mm
Length 25 mm
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