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EPCQ16SI8N Tech Specifications
| Category | Memory - Configuration Proms for FPGAs | |
| Manufacturer | ALTERA | |
| Mounting Type | Panel Mount | |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) | |
| Mount | Surface Mount | |
| Surface Mount | YES | |
| Mounting Feature | Bulkhead - Front Side Nut | |
| Number of Pins | 8Pins | |
| Shell Material | Aluminum Alloy | |
| Supplier Device Package | 8-SOIC | |
| Weight | 540.001716 mg | |
| Insert Material | Polyphenylene Sulfide (PPS) | |
| Number of Terminals | 8Terminals | |
| Backshell Material, Plating | - | |
| Voltage, Rating | - | |
| Package | Bulk | |
| Primary Material | Metal | |
| Base Product Number | 2M801-009 | |
| Mfr | Amphenol Aerospace Operations | |
| Product Status | Active | |
| Contact Materials | Copper Alloy | |
| Contact Finish Mating | Gold | |
| RoHS | Compliant | |
| Memory Types | FLASH | |
| Package Description | SOP, SOP8,2 | |
| Package Style | SMALL OUTLINE | |
| Number of Words Code | 2000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | SOP8,2 | |
| Operating Temperature-Min | -40 °C | |
| Reflow Temperature-Max (s) | 40 | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | EPCQ16SI8N | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| Number of Words | 2097152 wordsWord | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Package Code | SOP | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Intel Corporation | |
| Part Life Cycle Code | Obsolete | |
| Samacsys Description | FPGA - Configuration Memory IC - Ser. Config Mem Flash 16Mb 50 MHz | |
| Ihs Manufacturer | INTEL CORP | |
| Risk Rank | 7.87 | |
| Operating Temperature | -65°C ~ 150°C | |
| Series | 2M | |
| Packaging | Tube | |
| JESD-609 Code | e4 | |
| Part Status | Obsolete | |
| Termination | Crimp | |
| ECCN Code | EAR99 | |
| Connector Type | Receptacle, Male Pins | |
| Type | NOR TYPE | |
| Number of Positions | 5Positions |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Max Operating Temperature | 85 °C | |
| Min Operating Temperature | -40 °C | |
| Color | Black | |
| Applications | - | |
| HTS Code | 8542.32.00.51 | |
| Fastening Type | Threaded | |
| Current Rating (Amps) | 23A | |
| Technology | CMOS | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Terminal Position | DUAL | |
| Orientation | A | |
| Terminal Form | GULL WING | |
| Shielding | Shielded | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Ingress Protection | IP67 - Dust Tight, Waterproof | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | compliant | |
| Base Part Number | EPCQ16 | |
| Shell Finish | Black Zinc Nickel | |
| Shell Size - Insert | 16-5 | |
| JESD-30 Code | R-PDSO-G8 | |
| Operating Supply Voltage | 3.3 V | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Programmable Type | In System Programmable | |
| Max Supply Voltage | 3.6 V | |
| Min Supply Voltage | 2.7 V | |
| Memory Size | 16Mb | |
| Operating Supply Current | 100 µA | |
| Operating Mode | SYNCHRONOUS | |
| Shell Size, MIL | - | |
| Supply Current-Max | 0.02 mA | |
| Cable Opening | 0.805 (20.45mm) | |
| Organization | 2MX8 | |
| Output Characteristics | 3-STATE | |
| Seated Height-Max | 1.75 mm | |
| Memory Width | 8 | |
| Standby Current-Max | 0.0001 A | |
| Memory Density | 16777216 bit | |
| Max Frequency | 50 MHz | |
| Parallel/Serial | SERIAL | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Endurance | 100000 Write/Erase Cycles | |
| Data Retention Time-Min | 20 | |
| Features | Backshell | |
| Width | 3.9 mm | |
| Length | 4.9 mm | |
| Contact Finish Thickness - Mating | 50.0µin (1.27µm) | |
| Material Flammability Rating | - | |
| Radiation Hardening | No | |
| Lead Free | Lead Free |
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