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EPM2210F324C4 Tech Specifications

Category Embedded - CPLDs (Complex Programmable Logic Devices)
Manufacturer ALTERA
Mounting Type Surface Mount
Package / Case 324-BGA
Surface Mount YES
Supplier Device Package 324-FBGA (19x19)
Number of Terminals 324Terminals
Number of I/Os 272I/Os
Number of Macrocells 1700Macrocells
Package Description BGA, BGA324,18X18,40
Package Style GRID ARRAY
Moisture Sensitivity Levels 3
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA324,18X18,40
Supply Voltage-Nom 2.5 V
Reflow Temperature-Max (s) 30
Supply Voltage-Min 2.375 V
Operating Temperature-Max 85 °C
Rohs Code No
Manufacturer Part Number EPM2210F324C4
Package Code BGA
Package Shape SQUARE
Manufacturer Intel Corporation
Part Life Cycle Code Active
Number of I/O Lines 272I/O Lines
Ihs Manufacturer INTEL CORP
Supply Voltage-Max 2.625 V
Risk Rank 5.02
Operating Temperature 0°C ~ 85°C (TJ)
Series MAX® II
Packaging Tray
JESD-609 Code e0
Part Status Active
ECCN Code 3A991
Terminal Finish TIN LEAD
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Terminal Pitch 1 mm
Reach Compliance Code compliant
Base Part Number EPM2210
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
Power Supplies 1.5/3.3,2.5/3.3 V
Temperature Grade COMMERCIAL EXTENDED
Programmable Type In System Programmable
Propagation Delay 9.1 ns
Organization 0 DEDICATED INPUTS, 272 I/O
Seated Height-Max 2.2 mm
Programmable Logic Type FLASH PLD
Output Function MACROCELL
Number of Macro Cells 1700Macro Cells
JTAG BST YES
Voltage Supply - Internal 2.5V, 3.3V
Delay Time tpd(1) Max 7.0ns
Number of Logic Elements/Blocks 2210Logic Elements/Blocks
In-System Programmable YES
Width 19 mm
Length 19 mm
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