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EPM3256AFI256-10 Tech Specifications

Category Embedded - CPLDs (Complex Programmable Logic Devices)
Manufacturer ALTERA
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Supplier Device Package 256-FBGA (17x17)
Number of Terminals 256Terminals
Number of I/Os 161I/Os
Number of Macrocells 256Macrocells
Package Description BGA, BGA256,16X16,40
Package Style GRID ARRAY
Moisture Sensitivity Levels 3
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA256,16X16,40
Operating Temperature-Min -40 °C
Supply Voltage-Nom 3.3 V
Reflow Temperature-Max (s) 30
Supply Voltage-Min 3 V
Operating Temperature-Max 85 °C
Rohs Code No
Manufacturer Part Number EPM3256AFI256-10
Package Code BGA
Package Shape SQUARE
Manufacturer Intel Corporation
Part Life Cycle Code Obsolete
Number of I/O Lines 161I/O Lines
Ihs Manufacturer INTEL CORP
Supply Voltage-Max 3.6 V
Risk Rank 5.25
Operating Temperature -40°C ~ 85°C (TA)
Series MAX® 3000A
Packaging Tray
JESD-609 Code e0
Part Status Obsolete
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Terminal Pitch 1 mm
Reach Compliance Code compliant
Base Part Number EPM3256
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Power Supplies 2.5/3.3,3.3 V
Temperature Grade INDUSTRIAL
Programmable Type In System Programmable
Propagation Delay 10 ns
Organization 0 DEDICATED INPUTS, 161 I/O
Seated Height-Max 3.5 mm
Programmable Logic Type EE PLD
Number of Gates 5000Gates
Output Function MACROCELL
Number of Macro Cells 256Macro Cells
JTAG BST YES
Voltage Supply - Internal 3 V ~ 3.6 V
Delay Time tpd(1) Max 10.0ns
Number of Logic Elements/Blocks 16Logic Elements/Blocks
In-System Programmable YES
Width 17 mm
Length 17 mm
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