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EPXA4F672I2 Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array) with Microcontrollers
Manufacturer ALTERA
Mounting Type Surface Mount
Package / Case 672-BBGA, FCBGA
Mount Surface Mount
Surface Mount YES
Number of Pins 672Pins
Supplier Device Package 672-FBGA (27x27)
Number of Terminals 672Terminals
RoHS Compliant
Package Description BGA,
Package Style GRID ARRAY
Moisture Sensitivity Levels 3
Package Body Material PLASTIC/EPOXY
Supply Voltage-Nom 1.8 V
Reflow Temperature-Max (s) 30
Supply Voltage-Min 1.71 V
Rohs Code No
Manufacturer Part Number EPXA4F672I2
Package Code BGA
Package Shape SQUARE
Manufacturer Intel Corporation
Part Life Cycle Code Obsolete
Number of I/O Lines 426I/O Lines
Ihs Manufacturer INTEL CORP
Supply Voltage-Max 1.89 V
Risk Rank 5.79
Operating Temperature -40°C ~ 100°C
Series Excalibur™
Packaging Tray
JESD-609 Code e0
Part Status Obsolete
ECCN Code 3A001.A.7.A
Terminal Finish TIN LEAD
Max Operating Temperature 100 °C
Min Operating Temperature -40 °C
HTS Code 8542.39.00.01
Voltage - Supply 1.8V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Terminal Pitch 1 mm
Reach Compliance Code compliant
Frequency 200 MHz
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
Operating Supply Voltage 1.8 V
Interface EBI/EMI, UART/USART
Speed 200MHz
Organization 0 DEDICATED INPUTS, 426 I/O
Seated Height-Max 2.1 mm
Programmable Logic Type LOADABLE PLD
Number of Logic Elements/Cells 16640Logic Elements/Cells
EEPROM Size --
Number of Logic Blocks (LABs) 16640Logic Blocks (LABs)s
Output Function MACROCELL
Core Type 32-Bit ARM9
Data SRAM Bytes 64K
FPGA Gates 400K
Program SRAM Bytes 128K
FPGA Core Cells 16640
FPGA SRAM --
Width 27 mm
Length 27 mm
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