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5962-8605301LA Tech Specifications

Category Embedded - PLDs (Programmable Logic Device)
Manufacturer AMD
Surface Mount NO
Number of Terminals 24Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP, DIP24,.3
Clock Frequency-Max 22 MHz
Number of I/O Lines 10I/O Lines
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
JESD-609 Code e0
ECCN Code 3A001.A.2.C
Terminal Finish Tin/Lead (Sn/Pb) - hot dipped
Additional Feature VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
Pin Count 24
JESD-30 Code R-GDIP-T24
Number of Outputs 10Outputs
Qualification Status Not Qualified
Temperature Grade MILITARY
Propagation Delay 30 ns
Architecture PAL-TYPE
Number of Inputs 22Inputs
Organization 11 DEDICATED INPUTS, 10 I/O
Seated Height-Max 5.08 mm
Programmable Logic Type OT PLD
Screening Level 38535Q/M;38534H;883B
Output Function MACROCELL
Number of Dedicated Inputs 11Dedicated Inputs
Number of Product Terms 132Product Terms
Length 31.9405 mm
Width 7.62 mm
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