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- EF-DI-USXGMII-MAC-PROJ
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EF-DI-USXGMII-MAC-PROJ Tech Specifications
| Category | Software, Services | |
| Manufacturer | AMD | |
| Mounting Type | Through Hole | |
| Package / Case | Radial | |
| Dielectric Material | Polypropylene (PP), Metallized | |
| Lead Free Status / RoHS Status | -- | |
| Voltage Rating DC | 630V | |
| Voltage Rating AC | 310V | |
| Package | Electronic Delivery | |
| Base Product Number | EF-DI | |
| Mfr | AMD | |
| Product Status | Active | |
| For Use With/Related Products | Xilinx | |
| Operating Systems | - | |
| Operating Temperature | -55°C ~ 110°C | |
| Series | MKP339 | |
| Packaging | Bulk |
| Size / Dimension | 0.689 L x 0.394 W (17.50mm x 10.00mm) | |
| Tolerance | ±10% | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | -- | |
| Termination | PC Pins | |
| Type | License | |
| Applications | Automotive; EMI, RFI Suppression | |
| Capacitance | 0.47µF | |
| Lead Spacing | 0.591 (15.00mm) | |
| Media Delivery Type | Electronically Delivered | |
| License - User Details | Project | |
| License Length | 1 Year | |
| Features | -- | |
| Edition | - | |
| Height Seated (Max) | 0.650 (16.50mm) | |
| Ratings | AEC-Q200, X2 |
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