S71GL064A08BFW0B0 Tech Specifications

Category Specialized
Manufacturer AMD
Surface Mount YES
Number of Terminals 56Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FBGA, BGA56,8X8,32
Access Time-Max 100 ns
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA56,8X8,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
ECCN Code EAR99
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B56
Qualification Status Not Qualified
Temperature Grade OTHER
Supply Current-Max 0.06 mA
Standby Current-Max 0.000005 A
Memory IC Type MEMORY CIRCUIT
Mixed Memory Type FLASH+SRAM
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