AMD XC2C32A-3CPG56C Programmable Logic Devices
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XC2C32A-3CPG56C Tech Specifications
| Category | Embedded - PLDs (Programmable Logic Device) | |
| Manufacturer | AMD | |
| Surface Mount | YES | |
| Number of Terminals | 56Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | 6 X 6 MM, 0.50 MM PITCH, LEAD FREE, CSP-56 | |
| Clock Frequency-Max | 500 MHz | |
| Moisture Sensitivity Levels | 3 | |
| Number of I/O Lines | 33I/O Lines | |
| Operating Temperature-Max | 70 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA56,10X10,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V |
| Supply Voltage-Nom | 1.8 V | |
| JESD-609 Code | e1 | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| JESD-30 Code | S-PBGA-B56 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | COMMERCIAL | |
| Propagation Delay | 3 ns | |
| Organization | 33 I/O | |
| Seated Height-Max | 1.35 mm | |
| Programmable Logic Type | FLASH PLD | |
| Output Function | MACROCELL | |
| Length | 6 mm | |
| Width | 6 mm |
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XC2C32A-3CPG56C Documents
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