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XCKU085-2FLVB1760E Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer AMD
Lifecycle Status Production (Last Updated: 2 days ago)
Mount Axial, Through Hole
Mounting Type Surface Mount
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)
Voltage, Rating 350 V
RoHS Compliant
Number of I/Os 676I/Os
Package Bulk
Base Product Number XCKU085
Mfr AMD
Product Status Active
Packaging Bulk
Operating Temperature 0°C ~ 100°C (TJ)
Series Kintex® UltraScale™
Tolerance 0.1 %
Number of Terminations 2Terminations
Temperature Coefficient 100 ppm/°C
Resistance 2.8 kΩ
Max Operating Temperature 155 °C
Min Operating Temperature -55 °C
Composition Metal Film, Thin Film
Power Rating 500 mW
Max Power Dissipation 500 mW
Voltage - Supply 0.922V ~ 0.979V
ELV Compliant
Number of Resistors 1Resistor
Number of Logic Elements/Cells 1088325Logic Elements/Cells
Total RAM Bits 58265600
Number of LABs/CLBs 62190LABs/CLBs
Length 10.0076 mm
Diameter 3.7 mm
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