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XCR3384XL-7.5CSG280C Tech Specifications

Category Embedded - PLDs (Programmable Logic Device)
Manufacturer AMD
Surface Mount YES
Number of Terminals 280Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description CHIP SCALE, BGA-280
Moisture Sensitivity Levels 3
Number of I/O Lines 216I/O Lines
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA280,19X19,32
Package Shape SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B280
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Propagation Delay 7.5 ns
Organization 216 I/O
Seated Height-Max 1.2 mm
Programmable Logic Type EE PLD
Output Function MACROCELL
Length 16 mm
Width 16 mm
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XCR3384XL-7.5CSG280C Documents

Download datasheets and manufacturer documentation for   XCR3384XL-7.5CSG280C

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