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XCVU33P-L2FSVH2104E Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer AMD
Mounting Type Surface Mount
Package / Case 2104-BBGA, FCBGA
Supplier Device Package 2104-FCBGA (47.5x47.5)
RoHS Compliant
Number of I/Os 208I/Os
Package Tray
Base Product Number XCVU33
Mfr AMD
Product Status Active
Packaging Bulk
Operating Temperature 0°C ~ 100°C (TJ)
Series Virtex® UltraScale+™
Tolerance 1 %
Number of Terminations 2Terminations
Temperature Coefficient 25 ppm/°C
Resistance 8.66 kΩ
Max Operating Temperature 175 °C
Min Operating Temperature -55 °C
Composition Metal Film
Max Power Dissipation 250 mW
Voltage - Supply 0.698V ~ 0.742V
Number of Logic Elements/Cells 961800Logic Elements/Cells
Total RAM Bits 24746394
Number of LABs/CLBs 54960LABs/CLBs
Features Flame Retardant Coating, Moisture Resistant
Width 1.65 mm
Length 3.81 mm
Lead Free Lead Free
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