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XCZU19EG-2LFFVC1760E Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer AMD
Surface Mount YES
Number of Terminals 1760Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FCBGA-1760
Moisture Sensitivity Levels 4
Operating Temperature-Max 110 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Nom 0.85 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B1760
Temperature Grade OTHER
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.71 mm
Bus Compatibility CAN, I2C, SPI, UART
Length 42.5 mm
Width 42.5 mm
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XCZU19EG-2LFFVC1760E Documents

Download datasheets and manufacturer documentation for   XCZU19EG-2LFFVC1760E

  • Datasheets
XCZU19EG-2LFFVC1760E brand manufacturers: AMD, Elecinsight stock, XCZU19EG-2LFFVC1760E reference price.AMD. XCZU19EG-2LFFVC1760E parameters, XCZU19EG-2LFFVC1760E Datasheet PDF and pin diagram description download.You can use the XCZU19EG-2LFFVC1760E Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find XCZU19EG-2LFFVC1760E pin diagram and circuit diagram and usage method of function,XCZU19EG-2LFFVC1760E electronics tutorials.You can download from the Elecinsight.