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XCZU2CG-1LSFVA625I Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer AMD
Surface Mount YES
Number of Terminals 625Terminals
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA625,25X25,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom 0.85 V
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FCBGA-625
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B625
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.43 mm
Bus Compatibility CAN, I2C, SPI, UART
Width 21 mm
Length 21 mm
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XCZU2CG-1LSFVA625I Documents

Download datasheets and manufacturer documentation for   XCZU2CG-1LSFVA625I

  • Datasheets
XCZU2CG-1LSFVA625I brand manufacturers: AMD, Elecinsight stock, XCZU2CG-1LSFVA625I reference price.AMD. XCZU2CG-1LSFVA625I parameters, XCZU2CG-1LSFVA625I Datasheet PDF and pin diagram description download.You can use the XCZU2CG-1LSFVA625I Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find XCZU2CG-1LSFVA625I pin diagram and circuit diagram and usage method of function,XCZU2CG-1LSFVA625I electronics tutorials.You can download from the Elecinsight.