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XCZU2CG-2LSFVC784E Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer AMD
Surface Mount YES
Number of Terminals 784Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FCBGA-784
Moisture Sensitivity Levels 4
Operating Temperature-Max 110 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA784,28X28,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom 0.85 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B784
Temperature Grade OTHER
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.32 mm
Bus Compatibility CAN, I2C, SPI, UART
Length 23 mm
Width 23 mm
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XCZU2CG-2LSFVC784E Documents

Download datasheets and manufacturer documentation for   XCZU2CG-2LSFVC784E

  • Datasheets
XCZU2CG-2LSFVC784E brand manufacturers: AMD, Elecinsight stock, XCZU2CG-2LSFVC784E reference price.AMD. XCZU2CG-2LSFVC784E parameters, XCZU2CG-2LSFVC784E Datasheet PDF and pin diagram description download.You can use the XCZU2CG-2LSFVC784E Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find XCZU2CG-2LSFVC784E pin diagram and circuit diagram and usage method of function,XCZU2CG-2LSFVC784E electronics tutorials.You can download from the Elecinsight.