XCZU4CG-1LSFVC784I Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer AMD
Surface Mount YES
Number of Terminals 784Terminals
Supply Voltage-Nom 0.85 V
Package Style GRID ARRAY, FINE PITCH
Package Shape SQUARE
Package Equivalence Code BGA784,28X28,32
Package Code FBGA
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Operating Temperature-Max 100 °C
Moisture Sensitivity Levels 4
Package Description FCBGA-784
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Life Cycle Code Active
Rohs Code Yes
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B784
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.32 mm
Bus Compatibility CAN, I2C, SPI, UART
Width 23 mm
Length 23 mm
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XCZU4CG-1LSFVC784I Documents

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  • Datasheets
XCZU4CG-1LSFVC784I brand manufacturers: AMD, Elecinsight stock, XCZU4CG-1LSFVC784I reference price.AMD. XCZU4CG-1LSFVC784I parameters, XCZU4CG-1LSFVC784I Datasheet PDF and pin diagram description download.You can use the XCZU4CG-1LSFVC784I Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find XCZU4CG-1LSFVC784I pin diagram and circuit diagram and usage method of function,XCZU4CG-1LSFVC784I electronics tutorials.You can download from the Elecinsight.