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XCZU4CG-2LFBVB900I Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer AMD
Surface Mount YES
Number of Terminals 900Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FCBGA-900
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Nom 0.85 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Terminal Pitch 1 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B900
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 2.88 mm
Bus Compatibility CAN, I2C, SPI, UART
Length 31 mm
Width 31 mm
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XCZU4CG-2LFBVB900I Documents

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