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XCZU6CG-1FBVB900E Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer AMD
Surface Mount YES
Number of Terminals 900Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description BGA-900
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 0.876 V
Supply Voltage-Min 0.825 V
Supply Voltage-Nom 0.85 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Terminal Pitch 1 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B900
Temperature Grade OTHER
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 2.88 mm
Bus Compatibility I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)
Length 31 mm
Width 31 mm
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XCZU6CG-1FBVB900E Documents

Download datasheets and manufacturer documentation for   XCZU6CG-1FBVB900E

  • Datasheets
XCZU6CG-1FBVB900E brand manufacturers: AMD, Elecinsight stock, XCZU6CG-1FBVB900E reference price.AMD. XCZU6CG-1FBVB900E parameters, XCZU6CG-1FBVB900E Datasheet PDF and pin diagram description download.You can use the XCZU6CG-1FBVB900E Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find XCZU6CG-1FBVB900E pin diagram and circuit diagram and usage method of function,XCZU6CG-1FBVB900E electronics tutorials.You can download from the Elecinsight.