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XCZU9CG-2SFVC784E Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer AMD
Surface Mount YES
Number of Terminals 784Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description BGA-784
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA78428X28,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Max 0.876 V
Supply Voltage-Min 0.825 V
Supply Voltage-Nom 0.85 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B784
Temperature Grade OTHER
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.32 mm
Bus Compatibility I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)
Length 23 mm
Width 23 mm
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XCZU9CG-2SFVC784E Documents

Download datasheets and manufacturer documentation for   XCZU9CG-2SFVC784E

  • Datasheets
XCZU9CG-2SFVC784E brand manufacturers: AMD, Elecinsight stock, XCZU9CG-2SFVC784E reference price.AMD. XCZU9CG-2SFVC784E parameters, XCZU9CG-2SFVC784E Datasheet PDF and pin diagram description download.You can use the XCZU9CG-2SFVC784E Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find XCZU9CG-2SFVC784E pin diagram and circuit diagram and usage method of function,XCZU9CG-2SFVC784E electronics tutorials.You can download from the Elecinsight.