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XC17256ELVOG8I Tech Specifications

Category Memory
Manufacturer Xilinx
Surface Mount YES
Number of Terminals 8Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code TSOP
Package Description TSOP2,
Moisture Sensitivity Levels 3
Number of Words 262144 wordsWord
Number of Words Code 256000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TSOP2
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Supply Voltage-Nom (Vsup) 3.3 V
JESD-609 Code e3
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
HTS Code 8542.32.00.51
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 8
JESD-30 Code R-PDSO-G8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 3 V
Operating Mode SYNCHRONOUS
Organization 256KX1
Seated Height-Max 1.1938 mm
Memory Width 1
Memory Density 262144 bit
Parallel/Serial SERIAL
Memory IC Type CONFIGURATION MEMORY
Length 4.9276 mm
Width 3.937 mm
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