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XC17S05XLPDG8C Tech Specifications

Category Specialized
Manufacturer Xilinx
Surface Mount NO
Number of Terminals 8Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code DIP
Package Description DIP,
Moisture Sensitivity Levels 1
Number of Words 54544 wordsWord
Number of Words Code 54544Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 3.3 V
JESD-609 Code e3
Pbfree Code Yes
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
HTS Code 8542.32.00.71
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Peak Reflow Temperature (Cel) 250
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 8
JESD-30 Code R-PDIP-T8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 3 V
Operating Mode SYNCHRONOUS
Organization 54544X1
Seated Height-Max 4.5974 mm
Memory Width 1
Memory Density 54544 bit
Memory IC Type MEMORY CIRCUIT
Length 9.3599 mm
Width 7.62 mm
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XC17S05XLPDG8C Documents

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