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XCZU2CG-2LSFVA625E Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Xilinx
Surface Mount YES
Number of Terminals 625Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Date Of Intro 2018-03-09
Moisture Sensitivity Levels 4
Operating Temperature-Max 110 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA625,25X25,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom 0.85 V
JESD-609 Code e1
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B625
Temperature Grade OTHER
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.43 mm
Bus Compatibility CAN, I2C, SPI, UART
Length 21 mm
Width 21 mm
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XCZU2CG-2LSFVA625E Documents

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