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XCZU4EG-2LSFVC784E Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Xilinx
Surface Mount YES
Number of Terminals 784Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Date Of Intro 2018-03-09
Moisture Sensitivity Levels 4
Operating Temperature-Max 110 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA784,28X28,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom 0.85 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B784
Temperature Grade OTHER
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.32 mm
Bus Compatibility CAN, I2C, SPI, UART
Length 23 mm
Width 23 mm
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XCZU4EG-2LSFVC784E Documents

Download datasheets and manufacturer documentation for   XCZU4EG-2LSFVC784E

  • Datasheets
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