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XCZU4EG-3SFVC784I Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer Xilinx
Surface Mount YES
Number of Terminals 784Terminals
Supply Voltage-Nom 0.9 V
Package Style GRID ARRAY, FINE PITCH
Package Shape SQUARE
Package Code FBGA
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Operating Temperature-Max 100 °C
Moisture Sensitivity Levels 4
Date Of Intro 2017-02-15
Package Description FBGA,
Ihs Manufacturer XILINX INC
Part Life Cycle Code Transferred
Rohs Code Yes
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B784
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.32 mm
Width 23 mm
Length 23 mm
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XCZU4EG-3SFVC784I Documents

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