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XCZU4EV-3SFVC784I Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer Xilinx
Surface Mount YES
Number of Terminals 784Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description FBGA,
Date Of Intro 2017-02-15
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom 0.9 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B784
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.32 mm
Length 23 mm
Width 23 mm
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XCZU4EV-3SFVC784I Documents

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