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XCZU6CG-1FBVB900I Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer Xilinx
Surface Mount YES
Number of Terminals 900Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 0.876 V
Supply Voltage-Min 0.825 V
Supply Voltage-Nom 0.85 V
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B900
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 2.88 mm
Bus Compatibility I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)
Length 31 mm
Width 31 mm
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XCZU6CG-1FBVB900I Documents

Download datasheets and manufacturer documentation for   XCZU6CG-1FBVB900I

  • Datasheets
XCZU6CG-1FBVB900I brand manufacturers: AMD Xilinx, Elecinsight stock, XCZU6CG-1FBVB900I reference price.AMD Xilinx. XCZU6CG-1FBVB900I parameters, XCZU6CG-1FBVB900I Datasheet PDF and pin diagram description download.You can use the XCZU6CG-1FBVB900I Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find XCZU6CG-1FBVB900I pin diagram and circuit diagram and usage method of function,XCZU6CG-1FBVB900I electronics tutorials.You can download from the Elecinsight.