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XCZU6CG-2LFFVC900I Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Xilinx
Surface Mount YES
Number of Terminals 900Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description ,
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Nom 0.85 V
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B900
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.42 mm
Bus Compatibility CAN, I2C, SPI, UART
Length 31 mm
Width 31 mm
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XCZU6CG-2LFFVC900I Documents

Download datasheets and manufacturer documentation for   XCZU6CG-2LFFVC900I

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