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XCZU6CG-L1SFVC784I Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer Xilinx
Surface Mount YES
Number of Terminals 784Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description FBGA, BGA78428X28,32
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA78428X28,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Max 0.742 V
Supply Voltage-Min 0.698 V
Supply Voltage-Nom 0.72 V
Terminal Finish TIN SILVER COPPER
Additional Feature ALSO OPERATES AT 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B784
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.32 mm
Bus Compatibility I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)
Length 23 mm
Width 23 mm
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XCZU6CG-L1SFVC784I Documents

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