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XCZU6EG-3FFVB1156I Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer Xilinx
Surface Mount YES
Number of Terminals 1156Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description BGA,
Date Of Intro 2017-02-15
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Nom 0.9 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B1156
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.42 mm
Length 35 mm
Width 35 mm
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XCZU6EG-3FFVB1156I Documents

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