Elecinsight electronic parts stores,electronic components,electronic parts,electronics parts supply
My List
Order Status & History RFQ History WISH LIST
$ 0.00

XCZU7CG-2LFBVB900I Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Xilinx
Surface Mount YES
Number of Terminals 900Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description ,
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Nom 0.85 V
JESD-609 Code e1
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Terminal Pitch 1 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B900
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 2.88 mm
Bus Compatibility CAN, I2C, SPI, UART
Length 31 mm
Width 31 mm
Select at least one checkbox above to show similar products in this category.
View Similar

XCZU7CG-2LFBVB900I Documents

Download datasheets and manufacturer documentation for   XCZU7CG-2LFBVB900I

  • Datasheets
XCZU7CG-2LFBVB900I brand manufacturers: AMD Xilinx, Elecinsight stock, XCZU7CG-2LFBVB900I reference price.AMD Xilinx. XCZU7CG-2LFBVB900I parameters, XCZU7CG-2LFBVB900I Datasheet PDF and pin diagram description download.You can use the XCZU7CG-2LFBVB900I Embedded - Microcontrollers, DSP Datesheet PDF, find XCZU7CG-2LFBVB900I pin diagram and circuit diagram and usage method of function,XCZU7CG-2LFBVB900I electronics tutorials.You can download from the Elecinsight.