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XCZU7EV-1LFBVB900I Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Xilinx
Surface Mount YES
Number of Terminals 900Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Date Of Intro 2018-03-09
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Nom 0.85 V
JESD-609 Code e1
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B900
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 2.88 mm
Bus Compatibility CAN, I2C, SPI, UART
Length 31 mm
Width 31 mm
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XCZU7EV-1LFBVB900I Documents

Download datasheets and manufacturer documentation for   XCZU7EV-1LFBVB900I

  • Datasheets
XCZU7EV-1LFBVB900I brand manufacturers: AMD Xilinx, Elecinsight stock, XCZU7EV-1LFBVB900I reference price.AMD Xilinx. XCZU7EV-1LFBVB900I parameters, XCZU7EV-1LFBVB900I Datasheet PDF and pin diagram description download.You can use the XCZU7EV-1LFBVB900I Embedded - Microcontrollers, DSP Datesheet PDF, find XCZU7EV-1LFBVB900I pin diagram and circuit diagram and usage method of function,XCZU7EV-1LFBVB900I electronics tutorials.You can download from the Elecinsight.