QED234A4R0 Tech Specifications

Category Infrared, UV, Visible Emitters
Manufacturer AMI Semiconductor
Package / Case Radial, 5mm Dia (T 1 3/4)
Mounting Type Through Hole
Material Elastomer
Shape Square
Package Bulk
Mfr Laird Technologies - Thermal Materials
Product Status Obsolete
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Series Tflex™ XS400
Packaging Tape & Reel (TR)
Operating Temperature -40°C ~ 100°C (TA)
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Gray
Orientation Top View
Voltage - Forward (Vf) (Typ) 1.6V
Viewing Angle 40°
Usage -
Shelf Life -
Adhesive Tacky - One Side
Storage/Refrigeration Temperature -
Shelf Life Start -
Backing, Carrier -
Wavelength 940nm
Outline 228.60mm x 228.60mm
Current - DC Forward (If) (Max) 100mA
Thermal Conductivity 2.0W/m-K
Radiant Intensity (Ie) Min @ If 27mW/sr @ 100mA
Thermal Resistivity -
Thickness 0.0700 (1.778mm)
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