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- 10124677-1301003LF
AMPHENOL FCI ASIA PTE LTD 10124677-1301003LF Inline Module Sockets
Tray 288 PositionPosition
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10124677-1301003LF Tech Specifications
| Category | Memory Connectors - Inline Module Sockets | |
| Manufacturer | Amphenol | |
| Contact Plating | Gold | |
| Mounting Type | Surface Mount | |
| Mounting Feature | Normal, Standard - Top | |
| Housing Material | Thermoplastic (TP) | |
| Mounting Styles | PCB Mount | |
| Contact Materials | Copper Alloy | |
| Maximum Operating Temperature | + 85 C | |
| Minimum Operating Temperature | - 55 C | |
| Factory Pack QuantityFactory Pack Quantity | 560 | |
| Voltage, Rating | 1.2 V | |
| Package | Tray | |
| Base Product Number | 10124677 | |
| Mfr | Amphenol ICC (FCI) | |
| Product Status | Active |
| Memory Types | DDR4 SDRAM | |
| Packaging | Tray | |
| Series | - | |
| Type | DDR4 | |
| Number of Positions | 288 PositionPosition | |
| Pitch | 0.85 mm | |
| Current Rating | 0.75 A | |
| Contact Finish | Gold | |
| Termination Style | SMD/SMT | |
| Insulation Resistance | 1 MOhms | |
| Connector Style | DIMM | |
| Standards | MO-309 | |
| Key Type | Right | |
| Features | Latches, Solder Retention | |
| Contact Finish Thickness | 30.0µin (0.76µm) |
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