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10018783-10212TLF Tech Specifications

Category Card Edge Connectors - Edgeboard Connectors
Manufacturer Amphenol
Factory Lead Time 10 Weeks
Mounting Type Through Hole
Mount Through Hole
Contact Plating Gold
Housing Material Nylon
Material - Insulation Polyamide (PA), Nylon, Glass Filled
Contact Materials Copper Alloy
Series HPCE®
Packaging Tray
Operating Temperature -55°C~85°C
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder, Staggered
Connector Type Cantilever
Number of Positions 98Positions
Max Operating Temperature 85°C
Min Operating Temperature -55°C
Color Black
Number of Rows 2Rows
Gender Female
Contact Type Cantilever
Pitch 0.039 1.00mm
Orientation Straight
Current Rating 1.1A
Contact Finish Gold
Voltage - Rated AC 300V
Number of Contacts 98Contacts
Housing Color Black
Card Type PCI Express™
Read Out Dual
Insulation Resistance 1GOhm
Max Voltage Rating (AC) 300V
Features Board Guide, Locking Ramp
Width 7.4mm
Length 56mm
Contact Finish Thickness Flash
Card Thickness 0.062 1.57mm
Board Thickness 2.36mm
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
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10018783-10212TLF Documents

Download datasheets and manufacturer documentation for   10018783-10212TLF

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