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- 10018784-10200TLF
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10018784-10200TLF Tech Specifications
Category | Card Edge Connectors - Edgeboard Connectors | |
Manufacturer | Amphenol | |
Factory Lead Time | 9 Weeks | |
Contact Plating | Gold | |
Mount | Through Hole | |
Mounting Type | Through Hole | |
Housing Material | Nylon | |
Material - Insulation | Polyamide (PA), Nylon, Glass Filled | |
Contact Materials | Copper Alloy | |
Voltage Rated | 300V | |
Operating Temperature | -55°C~85°C | |
Packaging | Tray | |
Series | HPCE® | |
Published | 2008 | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Termination | Solder, Staggered | |
Connector Type | Cantilever | |
Number of Positions | 36Positions | |
Max Operating Temperature | 85°C | |
Min Operating Temperature | -55°C | |
Color | Black | |
Number of Rows | 2Rows | |
Gender | Female |
Contact Type | Cantilever | |
Pitch | 0.039 1.00mm | |
Orientation | Straight | |
Current Rating | 1.1A | |
Contact Finish | Gold | |
Voltage - Rated AC | 300V | |
Number of Contacts | 36Contacts | |
Housing Color | Black | |
Contact Resistance | 40mOhm | |
Card Type | PCI Express™ | |
Read Out | Dual | |
Insulation Resistance | 1GOhm | |
Max Voltage Rating (AC) | 300V | |
Features | Board Guide, Locking Ramp | |
Height | 11.25mm | |
Length | 25mm | |
Width | 7.4mm | |
Contact Finish Thickness | Flash | |
Card Thickness | 0.062 1.57mm | |
Board Thickness | 1.56mm | |
RoHS Status | RoHS Compliant | |
Flammability Rating | UL94 V-0 | |
Lead Free | Lead Free |
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10018784-10200TLF Documents
Download datasheets and manufacturer documentation for 10018784-10200TLF
- PCN Design/SpecificationGXT Plating 08/Aug/2013 Edge Card Drawing 12/Dec/2014
- PCN Assembly/OriginPCI Devices 10/Mar/2011
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