10023061-10227LF Tech Specifications

Category Memory Connectors - Inline Module Sockets
Manufacturer Amphenol
Factory Lead Time 6 Weeks
Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole
Mounting Feature Normal, Standard - Top
Housing Material Thermoplastic
Contact Materials Bronze
Insulation Materials Resin
Memory Types DDR2 SDRAM
Packaging Tray
Published 2011
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Through Hole
Number of Positions 240Positions
Max Operating Temperature 105°C
Min Operating Temperature -55°C
Number of Rows 2Rows
Pitch 2mm
Orientation Straight
Depth 7.6mm
Current Rating 500mA
Contact Finish Gold
Voltage - Rated AC 100V
Lead Pitch 1mm
Number of Contacts 240Contacts
Contact Resistance 30mOhm
Insulation Resistance 1MOhm
Connector Style DIMM
Standards MO-237
Features Board Guide, Latches
Height 25.6mm
Length 147.5mm
Contact Finish Thickness 15.0μin 0.38μm
Length - Tail 3.18mm
RoHS Status RoHS Compliant
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