Amphenol ICC (FCI) 10037402-11108LF Inline Module Sockets
240Contacts Tray 240Positions 2Rows
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10037402-11108LF Tech Specifications
| Category | Memory Connectors - Inline Module Sockets | |
| Manufacturer | Amphenol | |
| Factory Lead Time | 8 Weeks | |
| Contact Plating | Gold | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Mounting Feature | Normal, Standard - Top | |
| Insulation Materials | Resin | |
| Memory Types | DDR2 FBDRAM | |
| Packaging | Tray | |
| Published | 2006 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Number of Positions | 240Positions | |
| Max Operating Temperature | 105°C | |
| Min Operating Temperature | -55°C |
| Number of Rows | 2Rows | |
| Pitch | 2mm | |
| Orientation | Straight | |
| Depth | 7.75mm | |
| Contact Finish | Gold | |
| Voltage - Rated AC | 100V | |
| Number of Contacts | 240Contacts | |
| Contact Resistance | 30mOhm | |
| Insulation Resistance | 1MOhm | |
| Connector Style | FB-DIMM | |
| Standards | MO-256 | |
| Features | Board Lock, Latches | |
| Length | 148mm | |
| Contact Finish Thickness | 30.0μin 0.76μm | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant |
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10037402-11108LF Documents
Download datasheets and manufacturer documentation for 10037402-11108LF
- PCN PackagingMultiple Devices 24/Jul/2015
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