Amphenol ICC (FCI) 10053363-200LF Edgeboard Connectors
2Rows Tray
IN STOCK
: 300
Min. : 1
Mult. : 1
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10053363-200LF Tech Specifications
| Category | Card Edge Connectors - Edgeboard Connectors | |
| Manufacturer | Amphenol | |
| Factory Lead Time | 8 Weeks | |
| Contact Plating | Gold | |
| Mount | Through Hole | |
| Mounting Type | Through Hole, Right Angle | |
| Housing Material | Thermoplastic | |
| Material - Insulation | Thermoplastic | |
| Contact Materials | Copper Alloy | |
| Packaging | Tray | |
| Series | HPCE® | |
| Published | 2012 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Connector Type | Cantilever | |
| Number of Positions | 64 (Power)Position | |
| Max Operating Temperature | 105°C | |
| Min Operating Temperature | -5°C | |
| Color | Black | |
| Number of Rows | 2Rows | |
| Gender | Female |
| Contact Type | Cantilever | |
| Pitch | 0.100 2.54mm | |
| Orientation | Right Angle | |
| Current Rating | 7A | |
| Contact Finish | Gold | |
| Voltage - Rated AC | 1kV | |
| Number of Contacts | 64Contacts | |
| Housing Color | Black | |
| Contact Resistance | 55mOhm | |
| Card Type | Non Specified - Dual Edge | |
| Read Out | Dual | |
| Insulation Resistance | 5GOhm | |
| Number of Positions/Bay/Row | 32Positions/Bay/Rows | |
| Row Spacing | 3.8 mm | |
| Features | Board Guide | |
| Contact Finish Thickness | 30.0μin 0.76μm | |
| Card Thickness | 0.062 1.57mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant | |
| Lead Free | Lead Free |
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10053363-200LF Documents
Download datasheets and manufacturer documentation for 10053363-200LF
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