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10068597-12208LF Tech Specifications
Category | Memory Connectors - Inline Module Sockets | |
Manufacturer | Amphenol | |
Factory Lead Time | 8 Weeks | |
Mounting Type | Through Hole | |
Mount | Through Hole | |
Contact Plating | Gold | |
Mounting Feature | Normal, Standard - Top | |
Housing Material | Thermoplastic | |
Memory Types | DDR3 SDRAM | |
Packaging | Tray | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Termination | Through Hole | |
Number of Positions | 240Positions | |
Max Operating Temperature | 105°C | |
Min Operating Temperature | -55°C |
Number of Rows | 2Rows | |
Pitch | 1mm | |
Orientation | Straight | |
Current Rating | 500mA | |
Contact Finish | Gold | |
Voltage - Rated AC | 100V | |
Number of Contacts | 240Contacts | |
Insulation Resistance | 1GOhm | |
Connector Style | DIMM | |
Standards | MO-269 | |
Features | Board Lock, Latches | |
Height | 23.1mm | |
Contact Finish Thickness | 30.0μin 0.76μm | |
Length - Tail | 3.18mm | |
RoHS Status | RoHS Compliant | |
Radiation Hardening | No |
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10068597-12208LF Documents
Download datasheets and manufacturer documentation for 10068597-12208LF
- PCN PackagingMultiple Devices 24/Jul/2015
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