Amphenol ICC (FCI) 10081530-12227LF Inline Module Sockets
Tray 240Contacts 240Positions 2Rows
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10081530-12227LF Tech Specifications
| Category | Memory Connectors - Inline Module Sockets | |
| Manufacturer | Amphenol | |
| Factory Lead Time | 8 Weeks | |
| Contact Plating | Gold | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Mounting Feature | Normal, Standard - Top | |
| Housing Material | Thermoplastic | |
| Insulation Materials | Resin | |
| Memory Types | DDR3 SDRAM | |
| Packaging | Tray | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Through Hole | |
| Number of Positions | 240Positions | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -55°C | |
| Number of Rows | 2Rows |
| Voltage - Rated DC | 30V | |
| Pitch | 2mm | |
| Orientation | Straight | |
| Depth | 7.6mm | |
| Current Rating | 750mA | |
| Contact Finish | Gold | |
| Voltage - Rated AC | 30V | |
| Number of Contacts | 240Contacts | |
| Contact Resistance | 10mOhm | |
| Insulation Resistance | 1MOhm | |
| Connector Style | RDIMM | |
| Standards | MO-269 | |
| Features | Board Lock, Latches | |
| Length | 148mm | |
| Contact Finish Thickness | 15.0μin 0.38μm | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant |
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10081530-12227LF Documents
Download datasheets and manufacturer documentation for 10081530-12227LF
- PCN PackagingMultiple Devices 24/Jul/2015
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